The SG-BGA-7064 chip socket accommodates 0.75-mm-pitch ICs with 7.286 x 10.85-mm-footprints. The devices operate in excess in 10 GHz and support dense 48-ball BGA stacked devices using ...
The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...
The SG-BGA-6103 chip socket allows socketing of 0.8-mm-pitch 189-ball BGA/CSP JEDEC MO-207 ICs without performance loss. The 6.5-GHz socket supports stacked BGA devices having conductive elastomer ...