Semiconductor Engineering

Module Testing Adds New Challenges

System-in-package (SiP) and other advanced packaging technologies are putting more components together in tighter spaces than previously seen. Often these packages are contained in a module, which is ...
EDN

Combine in-circuit and functional component test advantages

Production test of a finished electronic product often involves two techniques: in-circuit test (ICT) and functional component test (FCT). The ICT technique examines a non-powered circuit board to ...
Semiconductor Engineering

Doing More At Functional Test

SE: Why is applying functional test content so challenging today? Ruiz: There are a couple of different factors that make successfully applying functional patterns on the tester a challenge. In fact, ...
EDN

Combining functional and in-circuit test

CheckSum’s Analyst ems+ft system combines in-circuit test (ICT) and functional test to target OEMs and contract manufacturers building power supplies, automotive electronics, medical electronics, ...
Electronic Design

Functional Testing and Validation for DDR4 and LPDDR4

Representing the most recent generation of double-data-rate (DDR) SDRAM memory, DDR4 and low-power LPDDR4 together provide improvements in speed, density, and power over DDR3. However, such speed and ...