The thermal management of high-density computing environments represents one of the most consequential engineering challenges ...

Privet Capital (“Privet”), the turnaround investor, announces the sale of Thermal Engineering (“Thermal” or “the Company”), the UK based supplier of high temperature lightweight aerospace components, ...

Fluid Mechanics and Thermal Engineering constitute interrelated disciplines that underpin much of modern engineering, advancing our capacity to predict, control, and optimise the behaviour of fluids ...

Increasing electronic packaging density leads to a greater need for precise thermal management. Hence, for electrical ...

NIMS, in joint research with the University of Tokyo, AIST, the University of Osaka, and Tohoku University, have proposed a ...

The journal "Case Studies in Thermal Engineering" recently published work by Inamori School Assistant Professor Mehdi Kabir Mehdi Kabir, Assistant Professor of Mechanical Engineering in Alfred ...

Heat management is becoming crucial to an increasing number of chips, and it’s one of a growing number of interconnected factors that must be considered throughout the entire development flow. At the ...

Heat issues resurface at advanced nodes, raising questions about how well semiconductors will perform over time for a variety of applications. Heat is becoming a much bigger problem for semiconductor ...

National Thermal Engineer Day 2021: The main objective behind celebrating the day is the commitment and dedication that the thermal engineers show. National Thermal Engineer Day is celebrated on 24 ...