StarFive, a leading provider of RISC-V architecture IP and solutions, and Theo End Computing(LECARC), a cloud computing CPU chip and solutions provider, officially announced a strategic partnership.

P’ confirmed for flagship devices of a major North American client Following the Samsung-Qualcomm alliance, Chips&Media and North American Big Tech solidify APV as the industry standard Targeting the ...

Launched today, Synopsys’ ESUN IP solution slashes AI tail latency and eliminates networking bottlenecks to enable seamless, scalable performance for modern AI infrastructure. b ...

Samsung Foundry, one of the world’s most advanced semiconductor chip manufacturers, faced yield-related issues over the past few years. To focus on resolving those problems, the company took a step ...

As multi-die designs continue to scale across AI and high-performance computing (HPC), the demand for higher bandwidth, tighter integration, and predictable system-level performance has never been ...

The artificial intelligence (AI) semiconductor competition is expanding into an ecosystem competition that encompasses not only advanced processes but also design, IP, and packaging. This is the ...

Manufactured in partnership with GlobalFoundries (GF) using their advanced 22nm Fully Depleted Silicon-on-Insulator (22FDX®) technology, the production-ready AKD1500 delivers highly efficient, ...

Perforce Agentic Gateway provides an orchestration layer for the AI-Driven Development Lifecycle (AI-DLC) to control token consumption and ensure compliance across MCPs. As enterprises move from AI ...

Allegro DVT announced its contribution to the European CHASSIS program's implementation of the Automotive Base Die chiplet. The 5nm chiplet is set to revolutionize the automotive semiconductor ...

Experts believe Vietnam can accelerate its semiconductor ambitions by prioritizing practical chip designs instead of competing immediately in the most advanced manufacturing nodes. As Vietnam ...