"Within 30 minutes, the misters brought the temperature down from 104 degrees to 97." ...
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Abstract: This paper proposes a highly integrated multichip silicon carbide (SiC) MOSFET power module packaging with optimized electrical and thermal performances. The structure of the module is to ...
Abstract: This letter proposes the use of a chip-on-ceramic heatsink packaging to reduce common-mode (CM) noise at the package level while improving thermal performance for SiC power modules. The ...