Abstract: Thermal management plays an increasingly important role in the design of 3-D integrated circuits (ICs) and packages. To deal with the related thermal issues, efficient and accurate ...
With digital twins (virtual replicas of objects or systems) of capacitors, engineers can simulate system-level interactions ...
Abstract: For next-generation advanced logic devices, gate-all-around field-effect transistors (GAAFETs) with characteristic size reaching the 10 nm scale, necessitate thorough consideration of ...
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