Semiconductor Engineering

Automated Multiphysics For Successful 3D-IC Design

For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...
Semiconductor Engineering

Preparing For The Multiphysics Future of 3D ICs

Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, ...
Business Insider

COMSOL Conference 2026 Schedule Announced, with Stops in the UK, U.S., Japan, and India

BURLINGTON, Mass., March 11, 2026 (GLOBE NEWSWIRE) -- COMSOL, an independently-owned global leader in modeling and simulation software, today announced the locations of its worldwide COMSOL Conference ...
The New York Times

The Looming Taiwan Chip Disaster That Silicon Valley Has Long Ignored

If China invades Taiwan and cuts off its chip exports to American companies, the tech industry and the U.S. economy would be crippled. Credit...Photo Illustration by Ben Jones; Source Photographs by ...
Morningstar

Cadence Completes Acquisition of Hexagon’s Design and Engineering Business, Advancing Leadership in Physical AI and Multiphysics

Complementary leading technologies combine to deliver comprehensive physical system design and AI-driven analysis solutions Cadence (Nasdaq: CDNS) today announced that it has completed its previously ...
IEEE

Maximum Electric Field Analysis in a Power Module using Schwarz-Christoffel Transformation

Abstract: The increase in operating voltage levels of power modules due to the adoption of wide bandgap semiconductor materials increases the risk of insulation breakdown and partial discharge.
Fast Company

Micron’s $100 billion New York semiconductor manufacturing project is facing local pushback

On a snowy Friday in January, dignitaries from both political parties braved the chill of a central New York winter for the groundbreaking ceremony of Micron Technology’s planned $100 billion ...
Idaho State Journal

Bids in, outcome sealed: The fight for Pocatello's semiconductor plant enters its final chapter

A federal lawsuit that thrust one of Pocatello’s largest employers into court-ordered receivership appears to be nearing its end — at least in legal terms. But for the hundreds of LA Semiconductor ...
EDN

Six critical trends reshaping 3D IC design in 2026 and beyond

AI compute is scaling at ~1.35× per year, nearly twice the pace of transistor scaling. Thus, the semiconductor industry has reached a hard inflection point: if we can’t scale down, we must scale up.
Forbes

2026 Is The Year Of Semiconductor Capacity Constraints

This voice experience is generated by AI. Learn more. This voice experience is generated by AI. Learn more. Hand holding ram memory chips inside gaming pc, symbolizing hardware shortages and rising ...
Reuters

Global chip sales expected to hit $1 trillion this year, industry group says

SAN FRANCISCO, Feb 6 (Reuters) - Global semiconductor sales are expected to hit $1 trillion this year, the Semiconductor Industry Association said on Friday. The group, which represents most U.S. chip ...