Abstract: We have developed a single-wafer vacuum encapsulation for microelectromechanical systems (MEMS), using a thick (20-mum) polysilicon encapsulation to package micromechanical resonators in a ...
Abstract: While celebrating the 21st year since the very first IEEE 802.11 “legacy” 2 Mbit/s wireless local area network standard, the latest Wi-Fi newborn is today reaching the finish line, topping ...
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