Abstract: Thermal management plays an increasingly important role in the design of 3-D integrated circuits (ICs) and packages. To deal with the related thermal issues, efficient and accurate ...
Abstract: Self-heating of the device will intensify the thermo-mechanical effects, leading to an increase in thermal stress. Currently, most of the research focuses on strain engineering of the device ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results