True modular smartphone hardware never went mainstream. That could change as phone makers look beyond magnets.

Multi-die designs introduce new engineering complexities and design considerations spanning packaging, verification, and ...

The company’s new IsoShield technology can squeeze most of the building blocks of a bias power supply into the same package.

ModulEdge, a Czech manufacturer of modular data centers, and Comino, a European leader in liquid cooling solutions, today announced a partnership to deliver integrated on-premise AI infrastructure ...